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US Patent Issued to QUALCOMM on Sept. 8 for "Three-dimensional (3D) integrated circuit (IC) (3DIC) package employing a redistribution layer (RDL) interposer facilitating semiconductor die stacking, and related fabrication methods" (California Inventors)

ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,542, issued on Sept. 8, was assigned to QUALCOMM Inc. (San Diego). "Three-dimensional (3D) integrated circuit (IC) (3DIC) package employing... और पढ़ें


US Patent Issued to Hitachi Energy Switzerland on Sept. 8 for "Power semiconductor module and manufacturing method" (Swiss Inventors)

ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,543, issued on Sept. 8, was assigned to Hitachi Energy Switzerland AG (Baden, Switzerland). "Power semiconductor module and manufacturing m... और पढ़ें


US Patent Issued to Seoul Viosys on Sept. 8 for "Light emitting module including light emitter with shaped P-type semiconductor layer" (South Korean Inventors)

ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,544, issued on Sept. 8, was assigned to Seoul Viosys Co. Ltd. (Gyeonggi-do, South Korea). "Light emitting module including light emitter wi... और पढ़ें


US Patent Issued to CHANGXIN MEMORY TECHNOLOGIES on Sept. 8 for "Semiconductor package structure and manufacturing method therefor" (Chinese Inventors)

ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,545, issued on Sept. 8, was assigned to CHANGXIN MEMORY TECHNOLOGIES INC. (Hefei City, China). "Semiconductor package structure and manufac... और पढ़ें


US Patent Issued to SAMSUNG ELECTRONICS on Sept. 8 for "Semiconductor package and method of manufacturing the same" (South Korean Inventors)

ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,546, issued on Sept. 8, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Semiconductor package and method of manufact... और पढ़ें


US Patent Issued to SAMSUNG ELECTRONICS on Sept. 8 for "Semiconductor package and method of manufacturing the same" (South Korean Inventors)

ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,547, issued on Sept. 8, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Semiconductor package and method of manufact... और पढ़ें


US Patent Issued to SILICONWARE PRECISION INDUSTRIES on Sept. 8 for "Electronic package and fabricating method thereof" (Taiwanese Inventors)

ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,548, issued on Sept. 8, was assigned to SILICONWARE PRECISION INDUSTRIES Co. LTD. (Taichung City, Taiwan). "Electronic package and fabricat... और पढ़ें


US Patent Issued to SAMSUNG ELECTRONICS on Sept. 8 for "Semiconductor package" (South Korean Inventors)

ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,549, issued on Sept. 8, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Gyeonggi-do, South Korea). "Semiconductor package" was invented by Ky... और पढ़ें


US Patent Issued to AUDI on Sept. 8 for "Power electronics arrangement with parallel connected semiconductor switches, power electronics device, motor vehicle, and method for producing a power electronics arrangement" (German Inventor)

ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,550, issued on Sept. 8, was assigned to AUDI AG (Ingolstadt, Germany). "Power electronics arrangement with parallel connected semiconductor... और पढ़ें


US Patent Issued to Samsung Display on Sept. 8 for "Apparatus for manufacturing display device and method of manufacturing display device" (South Korean Inventors)

ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,551, issued on Sept. 8, was assigned to Samsung Display Co. Ltd. (Yongin-si, South Korea). "Apparatus for manufacturing display device and ... और पढ़ें